8203;Akrometrix加热翘曲和平面度测量

Akrometrix加热翘曲和平面度测量仪ps200s

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Akrometrix加热翘曲和平面度测量仪ps200s概述

thermoiréps 200s是计量解决方案，利用阴影莫尔é测量技术结合自动相位步进表征出平面位移

样品高达150毫米×200毫米。随着时间的thermoir温度的分析能力，éps200s捕获完整的样本的历史行为的用户定义的热漂移中。

阴影莫尔é技术和动态相结合的温度测量是专利thermoiré平台的基础。动态分析是*有效的方法来分析由现实世界的过程和操作环境引起的机械行为。使用thermoiréps200s，工程师们将更好地了解材料的相互作用包，基板和完整的组件，允许一个全面系统的分析和提高其可靠性和一次通过率性能。的ps200s是至关重要的帮助满足日益增长的互联和可靠性要求的装置和基板水平。

Akrometrix加热翘曲和平面度测量仪ps200s实验室解决方案设计用于研发、生产和失效分析、可靠性等应用：

故障/缺陷分析

质量保证/质量控制

高容量测试出部分跟踪技术

通过/失败的决定与行业标准，简化了实时分析软件

通过接口分析软件的连接接口之间的形状匹配

材料与设计选择

有限元模型的验证

的ps200s可选模块：

数字图像相关（DIC）2模块

Akrometrix与cores加热平面度测量时的表现对比

前处理 自动化程度  定制 报告速度  报告形式

Akrometrix      需要  低   主要以定制形式  一般    较少

cores 不需要  高   一般不需要定制  自动化    4D视频+PDF等

cores 4DScanner core9100a

多点创新实现自动化

采用热风对流,辐射加热,模拟回流焊,玻璃基准面,3D面测技术,温度时间轴,不需要前处理,测量自动化,参数化管理,报告生成,办公化操作

高清测定实例影像

BGA平整度,BGA封装,连接器,端子平整度,连接器树脂翘曲,芯片翘曲,QFP,PCB基板,FPC基板,陶瓷基板测量实例的影像.

Akrometrix加热翘曲和平面度测量仪ps200s相关产品

CORES 平面度测量/平整度测试/加热翘曲测量

core9012a/core9031a/core9032a/core9037a/core9038a/core9045a/core9046a/core9050b/core9055a/core9060a/core9070a/core9100a

Akrometrix平面度测量/平整度测试/加热翘曲测量

AXP-300x233/Convective-Module-Tower/CRE6 Module/CXP/DFP Module/DIC 2.0 Module/Digital Fringe Projection/Digital Image Correlation/Akrometrix Interface Analysis/Akrometrix Part Tracking/PS200S/PS600S/Real Time Analysis/Akrometrix Shadow Moiré/Akrometrix Studio Platform

Thermal Warpage and Strain Measurement Tool

The TherMoiré PS200S is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for

samples up to 150 mm x 200 mm. With time-temperature profiling capability, the TherMoiré PS200S captures a complete history of a sample’s behavior during a user-defined thermal excursion.

The combination of the shadow moiré technique and dynamic temperature profiling is the foundation of the patented TherMoiré platform. Dynamic profiling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré PS200S, engineers will gain a better understanding of the interactions of materials, packages, substrates and complete assemblies, allowing for a thorough analysis of the system and improving its reliability and first pass yield performance. The PS200S is critical to helping meet the ever increasing interconnect and reliability requirements on both the device and substrate levels.

The PS200S is a laboratory solution designed for use in R&D, production and failure analysis/reliability applications such as:

Failure/defect analysis

Quality assurance/quality control

High Volume Testing complimented by Part Tracking technology

Pass/Fail decisions versus industry standards, streamlined by Real Time Analysis software

Shape matching between attaching interfaces via Interface Analysis Software

Material and Design Choices

FEA Model Validation

The PS200S Optional Modules:

Digital Image Correlation (DIC) 2.0 Module

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