厂家直销BGA返修台 高性能 bga返修台 三温区

一、HY-3832型BGA返修台特点

1、该机采用台湾高清触摸屏人机界面，PLC控制，可存储多组用户温度曲线数据.开机密码保护和修改功能,工作时温度以曲线的方式将数据反应到触摸屏内显示，具有瞬间曲线分析功能.

2、采用线性滑座使X、Y、Z三轴皆可做精细微调或快速定位动作，具有较高的定位精度和快捷的操作性.

3、采用三温区独立加热，上下温区热风加热，底部温区红外加热，温度精确控制在±2度，上部温区可视需要自由移动，第二温区可上下调节，上下部发热器可同时设置多段温度控制. IR预热区可依实际要求调整输出功率.

4、热风嘴可360°旋转.底部红外发热器可使PCB板受热均匀.

5、选用高精度K型热电偶闭环控制,外置测温接口实现对温度的精密检测.PCB板定位采用V字形槽，灵活方便的可移动式**夹具对PCB板起到保护作用，防止PCB边缘器件损伤及PCB变形，并能适应各种BGA封装尺寸的返修.

6、采用大功率横流风机迅速对PCB板进行冷却，提高工作效率.同时内置真空泵，外置真空吸笔，以方便快捷取拿BGA芯片.

7、焊接工作完毕具有程序结束报警提示功能。

8、本机经过CE认证，异常事故自动断电保护装置.在温度失控情况下，电路能自动断电，拥有双重超温保护功能.

二、技术参数：1总功率4800W2上部加热功率800W3下部加热功率第二温区1200W，第三（IR）温区2700W4电源AC220V±10％50/60Hz5外形尺寸635×600×560mm6定位方式V字形卡槽,PCB支架可X、Y任意方向调整并配置**夹具7温度控制K型热电偶（K Sensor）闭环控制，独立控温，精度可达±3度；8PCB尺寸Max 380×320mm Min 10×10 mm9电气选材高灵敏温度控制模块＋台达PLC＋台湾触摸屏10机器重量40kgFeatures:

一、Adopted with Linear slider, so all the three axles (X, Y, and Z) can do fine tuning and quick orientation with perfect positioning accuracy and speedily maneuverability

二、Equipped with touch panel interface and PLC controlling to ensure it work stably and reliably. And it can storage multiple temperature profiling data of users. With password protection and modification function while power on. The temperature profiles will be displayed on the touch screen

三、Three temperature zones to heat up independently, hot air heat up between up and down zones, IR heat in the bottom, temperature precise control is in±3℃.The upper temperature zone can be moved freely according to needs, the second zone can be adjusted up and down. The top and bottom heaters can be set several segments control at the same time. IR heating zone can be adjusted output power in the light of operation requirements.

四、The hot air nozzle can be rotated in 360 degree, the IR heater in the bottom can heat up the PCB board uniformly.

五、High accuracy K-type thermocouple closed-loop controlling. It can test temperature accurately through external temperature measurement interface, PCB board positioned by closed V-shape slot. The flexible and convenient universal jigs can prevent any damage or PCB deformation as well as it is suitable for all size of BGA package.

六、Large power fan to cool down the PCB quickly. The built-in vacuum pump and external vacuum nozzle is able to take BGA chips out easily.

Having alarm prompt function after welding is done, specially added early warning function for

七、convenient operation.

八、It has Passed CE certificate.  It is equipped with emergency stop switch and protection equipment to power off automatically when abnormal accident happened. Under this situation that temperature is out of control, circuit can automatically cut off the power with double over temperature protection function.

         Technology ParametersTotal Power4800WUpper Heating Power800WLower Heating PowerSecond zone:1200W, Third zone: IR 2700WPower SupplyAC 220V±10% 50/60HZOverall DimensionL605*W600*H520mmLocating ModeV-shape card slot, PCB holder can be adjustable

by X and Y axes with universal jigs.Temperature ControllingK-type thermocouple closed loop control, independent temperature control, precision up to ±3 degreePCB SizeMax 380*320mm, Min 10*10mmElectrical MaterialHigh sensitive temperature control module,Touch Screen made-in TaiwanWeight of machine30KG

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