三星贴片机CP45F/CP45FV/CP45FV NEO
MODEL型号 | CP45FV NEO | ||||||
贴装头 | 6个贴装头 | ||||||
伺服系统 | 伺服马达驱动X、Y轴- Z轴移动驱动系统 | ||||||
对中方式 | CP45F | 飞行系统 | |||||
CP45FV | 全视觉(Fly Vision+Stage Vision) | ||||||
基板尺寸 | 标 准 50×30×0.38mm~460×400×4.2mm 选项(CP45-L NEO) 50×100×0.38mm~510×460×4.3mm | ||||||
贴装速度 | CHIP | 0.178秒/片IPC9580 14900CPH(1608) | |||||
QFP | 0.75秒/片(飞行对中) 1.6秒/片(固定视觉系统) | ||||||
喂料器数量 | 带式喂料器(104个可选) | ||||||
运输方向 | 左-右(可选:右-左) | ||||||
贴装精度 | CHIP | 0603(0201)Chip ±0.08mm 1005Chip | |||||
QFP | ±0.1mm QFP ±0.04mm | ||||||
原件范围 | 飞行相机 1005(0402)~□22mm IC,0603(0201)~□12mm (选项) | ||||||
标准固定相机(FOV35) ~□32mm IC(Lead Pitch:0.4mm) | |||||||
特殊固定相机(FOV20) ~□17mm IC(Lead Pitch:0.3mm) | |||||||
特殊固定相机(FOV45) ~□42mm IC(Lead Pitch:0.5mm) | |||||||
*小.Lead Pitch(QFP) 0.3mm(with FOV20 Vision) | |||||||
*小.Ball Pitch(BGA) 0.5mm(with FOV20 Vision) | |||||||
部品*高 15mm(9mm:with flying vision) | |||||||
电源需求 | AC220V~240V(50/60 Hz,3Phase) RMS 2.6kVA(max:6kVA) | ||||||
面积/尺寸 | (mm)(x*y*h) 1650×1540×1420 | ||||||
净重 | 大约1380kg | ||||||
喂料器种类 | 8mm,12mm,16mm,24mm,32mm,44mm,56mm带式飞达、托盘、震动飞达、20动多盘式IC柜 | ||||||
耗气量 | 5kg/cm3,160Nl/min
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